Physical vapor phase degradation (PVD) – theoretically – is a complex subject. This is the process by which multiple spherical molecule samples are placed on a solid support in a vacuum chamber.
When manufacturing an item, PVD is often used. In particular PVD is used for the manufacture of aluminum foil film for balloons and snack bags, semiconductor devices and coated cutting tools used for metal processing. In addition to PVDs used in manufacturing, smaller tools have been developed (for scientific purposes). Extreme thin films, such as atomic layers, are used, and are mostly used for smaller substrates. For example, mini E-Beam evaporators can store single layer layers of virtually all materials with up to 3500 ° C high melting points.
Many experts claim that PVD coatings are tougher and corrosive than coatings used in galvanizing. As PVD coatings have high impact strength, high temperature thresholds, excellent abrasion resistance and durability, the protective coatings are almost never necessary. Common coatings applied by PVD include zirconium nitride, titanium, aluminum nitride, titanium nitride and chrom nitride
Two very common types of PVD processes are evaporation of atomization and electron beam. Below is a brief description of each of them:
The atomization process involves simply placing a "target" material on a source that is a "substrate" – something like a silicon sheet vacuum chamber. The target is bombed with ionized gas, which is often an inert gas such as argon. In the semiconductor industry, atomization is used to place a very thin film on a large number of materials for the processing of integrated circuits. Sputtering is the most important for anti-reflection coatings for optical applications.
Sputtering with low substrate temperature is a great way to store metals for thin film transistors. One of the most famous products of atomization is the low-emission coating on the glass used to make double-pane windows. The advantage of spraying is that high melting agents can easily swell, but the evaporation of the same material in an evaporator evaporator is difficult and causes problems.
Evaporation of the electron beam or evaporation of the E-jet process The process of suppressing a target by an electron beam, which is provided by means of tungsten fibers with high volumes of vacuum. The electron beam vaporizes the atoms from the source material into the gas phase. The atoms then form a solid material and coat all materials in the vacuum chamber that are in a thin layer.
The biggest advantage of E-Beam Evaporation is that it allows direct source of energy from the source during heating and is very effective for inserting clean evaporated material into a substrate. Additionally, the rate of deposition in this process is 1 mm every 60 seconds, as low as a few micrometers per second every 60 seconds – these are very solid statistics. Compared to other methods and processes, the efficiency of utilization of materials is extremely high. Due to the high deposition rate, industry chooses this process for heat-insulating coatings aircraft machines, hard coatings for cutting tools and electronic and optical films for semiconductors.
Choosing Sputtering and E-Beam Evaporation depends on what industry PVD is used. Each of them has a very special role and is important for the future of PVD.